RoboCup: Redesign 2014-2015
Contents
Phase I: Techanical Analysis
The first stage of the 2014-2015 RoboCup redesign involves brainstorming potential upgrades by researching new technologies/resources since the last revision. A parallel analysis of current robot bugs and potential enhancements is also done at this time. Outlined below is a listing of resources that the team used in it's brainstorming stage.
Phase II: Design
Layout
To Do
- Determine location and placement for dribbler motor header
- Update hall connection header to right angled one
- Determine optimal placemnt direction for drive motor phase connections (motor board)
- Add connection header for ball sensor to control board
- Update the 14-pin connection header (female) for the control-to-motor board connection
- Add pin locations to all connection housings in CAD part files
- Add wires among connections in CAD assembly files
- Finalize method for adjusting motor wire lengths when motors arrive
- Determine kicker connections and integration
Radio
To Do
- Determine optimal secondary frequency for base station updates
FPGA
To Do
- Transition the I2C bus lines to the microcontroller
- Update Verilog for new balanced encoder signals (A+, A-, B+, B-)
- ( (A+) + (A-) == 0 ) should be true for no errors
Motors
To Do
- Order motor controller boards
Batteries
http://www.hobbyking.com/hobbyking/store/__9939__ZIPPY_Flightmax_1800mAh_5S1P_40C.html
http://www.hobbyking.com/hobbyking/store/__25516__ZIPPY_Compact_2450mAh_5S_35C_Lipo_Pack.html
http://www.hobbyking.com/hobbyking/store/__9461__Turnigy_2200mAh_5S_30C_Lipo_Pack.html
http://www.hobbyking.com/hobbyking/store/__9944__ZIPPY_Flightmax_2200mAh_5S1P_40C.html
Phase III: Production
https://learn.sparkfun.com/tutorials/electronics-assembly
http://www.soldermask.com/ <- Sparfun uses these guys for all their solder stencils